Heating Elements
Silicon Carbide and Molybdenum Di-Silicide Heating Element used to heat high temperature electric kilns and furnaces.
- Available in Silicon Carbide and Molybdenum Di-Silicide.
- A special protective film ensures that our elements have a longer service life than the average.
- Easy to install; easy to maintain.
General Overview
IPS Ceramics’ Heating Elements are used to heat high-temperature electric kilns and furnaces. We offer a range of different Heating Elements in different designs, including Straight Bar, Spiral Bar, Spiral Return, U and CU-Shaped elements.
Our Silicon Carbide Heating Elements are manufactured from recrystallised high-purity alpha silicon carbide (RSiC; used in hot zones because of its excellent performance at high temperatures) and Silicon-Infiltrated Silicon Carbide (SiSiC/RBSiC; used in cold zones due to its low resistivity and energy saving performance). We also apply special protective coatings for different atmospheres to our Element’s hot zones to ensure that they provide a longer than average service life. We also provide the clips and braids for the Silicon Carbide Elements.
Silicon Carbide Elements are often used for kilns and furnaces operating above 1200°C. In these environments, they give a long, stable service life. They also have the ability to work at temperatures up to 1600°C. Benefits of IPS Ceramics’ Silicon Carbide Heating Elements include being anti-oxidisation, anti-corrosion, long lasting, resistant to deformation from heat, easy to install, and easy to maintain.
We also offer Molybdenum Di-Silicide (colloquially known as Moly-D) Heating Elements. These elements have excellent properties which allow them to be used for furnaces working at very high temperatures – 1700°C or even 1800°C (in dry air).
Technical Information
| Typical Physical Properties | ||
| Material | Silicon Carbide | Molybdenum Di-Silicide |
| Max Service Temperature (in air) | 1600 °C / 2910 °F | 1800 °C / 3270 °F |
| Bulk Density | 2.5 g/cm³ | 5.6 g/cm³ |
| Open Porosity | 20 % | 1 % |
| MoR @ Room Temp. | 50 MPa | 350 MPa |
| Thermal Conductivity | 20 W/mK | 20 W/mK |
| Thermal Expansion 20-1000°C | 4.5 x10-6/K | 9 x10-6/K |
| Composition | ||
| SiC | > 99 % | — |








